Gender and collaboration patterns in a temporal scientific authorship network
- Gecia Bravo-Hermsdorff
- Valkyrie Felso
- et al.
- 2019
- Applied Network Science
Review
Publications
13 results for Joana Maria
Two fragrances designed for brazilian millennials
- David Apel
- Sophie Bensamou
- et al.
- 2019
- ICCC 2019
Conference paperComputational-creativity enabled one pan seasonings for retail sale
- Jing Fu
- Richard T. Goodwin
- et al.
- 2019
- ICCC 2019
Conference paperColumn Interconnects: A Path Forward for Embedded Cooling of High Power 3D Chip Stacks
- Mark D. Schultz
- Cyril Cabral
- et al.
- 2018
- ECTC 2018
Conference paperAssembly and packaging of non-bumped 3D chip stacks on bumped substrates
- Bing Dang
- Joana Maria
- et al.
- 2014
- ECTC 2014
Conference paperNiFe-based Ball-limiting-metallurgy (BLM) for microbumps at 50μm pitch in 3D chip stacks
- Bing Dang
- Steven Wright
- et al.
- 2013
- ECTC 2013
Conference paperMicro-interconnection reliability: Thermal, electrical and mechanical stress
- Steven L. Wright
- Cornelia Tsang
- et al.
- 2012
- ECTC 2012
Conference paper2.5D and 3D technology challenges and test vehicle demonstrations
- John Knickerbocker
- Paul Andry
- et al.
- 2012
- ECTC 2012
Conference paperMeasurement of microbump thermal resistance in 3D chip stacks
- E.G. Colgan
- Paul Andry
- et al.
- 2012
- SEMI-THERM 2012
Conference paper3D Chip stacking with 50 μm pitch lead-free micro-c4 interconnections
- Joana Maria
- Bing Dang
- et al.
- 2011
- ECTC 2011
Conference paper