Extended abstract :C4NP - solder bumps for flip chip and microbumps for 3D
- Klaus Ruhmer
- David Hawken
- et al.
- 2008
- GBC 2008
Publications
5 results for David Danovitch
Chip package interaction evaluation for a high performance 65nm and 45nm CMOS technology in a stacked die package with C4 and wirebond interconnections
- Christopher Muzzy
- David Danovitch
- et al.
- 2008
- ECTC 2008
Low-cost wafer bumping
- Peter A. Gruber
- Luc Bélanger
- et al.
- 2005
- IBM J. Res. Dev
Injection molded solder technology for Pb-free wafer bumping
- P. Gruber
- D.Y. Shih
- et al.
- 2004
- ECTC 2004
Pb-free solder alloys for flip chip applications
- S.K. Kang
- J. Horkans
- et al.
- 1999
- ECTC 1999