Hotspot-optimized interlayer cooling in vertically integrated packages
- T. Brunschwiler
- Bruno Michel
- et al.
- 2008
- MRS Fall Meeting 2008
Conference paper
Publications
13 results for U. Kloter
High heat flux flow boiling in silicon multi-microchannels - Part II: Heat transfer characteristics of refrigerant R245fa
- Bruno Agostini
- John Richard Thome
- et al.
- 2008
- Int. J. Heat Mass Transf.
PaperHigh heat flux flow boiling in silicon multi-microchannels - Part I: Heat transfer characteristics of refrigerant R236fa
- Bruno Agostini
- John Richard Thome
- et al.
- 2008
- Int. J. Heat Mass Transf.
PaperRadially oscillating flow hybrid cooling system for low profile electronics applications
- R. Wälchli
- R. Linderman
- et al.
- 2008
- SEMI-THERM 2008
Conference paperForced convective interlayer cooling in vertically integrated packages
- Thomas Brunschwiler
- Bruno Michel
- et al.
- 2008
- ITherm 2008
Conference paperInterlayer cooling potential in vertically integrated packages
- T. Brunschwiler
- Bruno Michel
- et al.
- 2008
- Microsystem Technologies
PaperHigh heat flux flow boiling in silicon multi-microchannels - Part III: Saturated critical heat flux of R236fa and two-phase pressure drops
- Bruno Agostini
- Rémi Revellin
- et al.
- 2008
- Int. J. Heat Mass Transf.
PaperHierarchical nested surface channels for reduced particle stacking and low-resistance thermal interfaces
- R. Linderman
- T. Brunschwiler
- et al.
- 2007
- SEMI-THERM 2007
Conference paperHierarchically nested channels for fast squeezing interfaces with reduced thermal resistance
- Thomas Brunschwiler
- Urs Kloter
- et al.
- 2007
- IEEE Transactions on Components and Packaging Technologies
PaperDirect liquid jet-impingement cooling with micronsized nozzle array and distributed return architecture
- Thomas Brunschwiler
- Hugo Rothuizen
- et al.
- 2006
- ITherm 2006
Conference paper