Effects of in-plane property variations on warpage shapes of organic substrates
- Sayuri Kohara
- Keishi Okamoto
- et al.
- 2019
- EPTC 2019
Conference paper
Publications
21 results for Keishi Okamoto
CFD analysis of molten solder flow behavior and bridging mechanism during solder bump formation
- Risa Miyazawa
- Keishi Okamoto
- et al.
- 2019
- InterPACK 2019
Conference paperEffects of build-up material properties on warpage dispersion of organic substrates caused by manufacturing variations
- Keishi Okamoto
- Sayuri Kohara
- et al.
- 2017
- InterPACK 2017
Conference paperThe mechanism of the low-k stress reduction in chip assembly by shorter solder bump height
- Keiji Matsumoto
- Keishi Okamoto
- et al.
- 2017
- InterPACK 2017
Conference paperSolder Injected through Via for Multi Stacked Wafers
- Akihiro Horibe
- Kuniaki Sueoka
- et al.
- 2016
- ECTC 2016
Conference paperAdvanced interconnect technologies in the era of cognitive computing
- Yasumitsu Orii
- Akihiro Horibe
- et al.
- 2016
- Pan Pacific 2016
Conference paperWarpage analysis of organic substrates for 2.1D packaging
- Sayuri Kohara
- Keishi Okamoto
- et al.
- 2015
- 3DIC 2015
Conference paperThrough silicon via process for effective multi-wafer integration
- Akihiro Horibe
- Kuniaki Sueoka
- et al.
- 2015
- ECTC 2015
Conference paperEffects of low CTE materials on thermal deformation of organic substrates in flip chip package application
- Hiroyuki Mori
- Sayuri Kohara
- et al.
- 2015
- InterPACK 2015
Conference paperWarpage modeling technique of organic interposer considering deformation by insulator material shrinkage
- Keishi Okamoto
- Sayuri Kohara
- et al.
- 2015
- ICEP-IAAC 2015
Conference paper