Publications

16 results for Vincent McGahay

Formation mechanism and suppression methods of copper dendrites in BEOL integration
- - Shaoning Yao
  - Wei-Tsu Tseng
  - et al.
- 2011
- ADMETA 2011
Characterization, Modeling and Extraction of Cu Wire Resistance for 65 nm Technology
- - Ning Lu
  - M. Angyal
  - et al.
- 2007
- CICC 2007
BEOL integration of highly damage -resistant porous ultra low-k material using direct CMP and via-first process
- - T. Iijima
  - Q. Lin
  - et al.
- 2006
- IITC 2006
65nm Cu integration and interconnect reliability in low stress K=2.75 SiCOH
- - V. McGahay
  - G. Bonilla
  - et al.
- 2006
- IITC 2006
PECVD Low-k (∼2.7) dielectric SiCOH film development and integration for 65 nm CMOS devices
- - K. Ida
  - S. Nguyen
  - et al.
- 2005
- AMC 2005
Lower-k SiCOH integration for 65 nm ground rules
- - T. Nogami
  - S. Lane
  - et al.
- 2005
- VMIC 2005
Low-k/copper integration scheme suitable for ULSI manufacturing from 90nm to 45nm nodes
- - T. Nogami
  - S. Lane
  - et al.
- 2005
- Optics East 2005
High performance 65 nm SOI technology with enhanced transistor strain and advanced-low-K BEOL
- - W.-H. Lee
  - A. Waite
  - et al.
- 2005
- IEDM 2005
Thermal cycle reliability of stacked via structures with copper metallization and an organic low-k dielectric
- - R. Filippi
  - J.F. McGrath
  - et al.
- 2004
- IRPS 2004
Thermal cycle reliability of stacked via structures with copper metallization and an organic low-k dielectric
- - R. Filippi
  - J.F. McGrath
  - et al.
- 2004
- IRPS 2004