Stress development, intermetallic phase formation, and reaction kinetics in Co-Cr and Co-Ti thin films
- F. Faupel
- D. Gupta
- et al.
- 1990
- Journal of Applied Physics
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5 results for F. Faupel
Adhesion and deformation of metal/polyimide layered structures
- F. Faupel
- C.H. Yang
- et al.
- 1989
- Journal of Applied Physics
Direct measurements of Cu diffusion into a polyimide below the glass transition temperature
- F. Faupel
- D. Gupta
- et al.
- 1989
- Applied Physics Letters
Stress relaxation during thermal cycling in metal/polyimide layered films
- S.T. Chen
- C.H. Yang
- et al.
- 1988
- Journal of Applied Physics
Adhesion and deformation study of metal/polymer structures by a stretch deformation method
- P.S. Ho
- F. Faupel
- 1988
- Applied Physics Letters