Vapor Phase Deposition of Palladium for Electroless Copper Plating
- Richard R. Thomas
- Jae M. Park
- 2019
- JES
Publications
10 results for Jae M. Park
Adhesion of copper and chromium films to polyimide studied by static SIMS of the interface
- W.J. van Ooij
- R.H.G. Brinkhuis
- et al.
- 2004
- Surface and Interface Analysis
Photochemical surface modification of poly(ethylene terephthalate)
- Ronald D. Goldblatt
- Jae M. Park
- et al.
- 2003
- Journal of Applied Polymer Science
Surface composition of polystyrene
- Ronald D. Goldblatt
- Gerald J. Scilla
- et al.
- 2003
- Journal of Applied Polymer Science
Thermoplastic character of polyimide blends
- B.J. Han
- Jae M. Park
- et al.
- 1993
- Polymer Engineering & Science
Adhesion and XPS studies on a fluoropolymer-metal interface
- Jae M. Park
- L.J. Matienzo
- et al.
- 1991
- Journal of Adhesion Science and Technology
Processible conductive copolymers of 3-methylthiophene and methyl methacrylate
- Wu-Song Huang
- Jae M. Park
- 1987
- Journal of the Chemical Society, Chemical Communications
Conductive copolymers of alkylthiophenes and methylmethacrylate
- Wu-Song Huang
- Young H. Kim
- et al.
- 1987
- International SAMPE Electronics Conference 1987
Adhesion and interface studies between copper and polyimide
- Y.-H. Kim
- G.F. Walker
- et al.
- 1987
- Journal of Adhesion Science and Technology
Gold/fluorocarbon adhesion
- Jae M. Park
- R.D. Goldblatt
- et al.
- 1987
- Journal of Adhesion Science and Technology