The angular dependence of preferential sputtering and composition in aluminum-copper thin films
- P. Rudeck
- J.M.E. Harper
- et al.
- 1989
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
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15 results for Peter M. Fryer
A comparison between aluminum and copper interactions with high-temperature oxide and nitride diffusion barriers
- A. Charai
- S.E. Harnstram
- et al.
- 1989
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Angular dependence of preferential sputtering and composition in aluminum-copper thin films
- P. Rudeck
- J.M.E. Harper
- et al.
- 1988
- Applied Physics Letters
Tungsten-rhenium alloys as diffusion barriers between aluminum and silicon
- S.-E. Hörnström
- T. Lin
- et al.
- 1988
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Relationship between substrate bias and microstructure in magnetron-sputtered AlCu films
- T. Lin
- K.Y. Ahn
- et al.
- 1987
- Thin Solid Films