Publications

15 results for Peter M. Fryer

High temperature process limitation on TiSi2
- - C.-Y. Ting
  - F.M. d'Heurle
  - et al.
- 2019
- JES
Ambient Gas Effects on the Reaction of Titanium with Silicon
- - Subramanian S. lyer
  - Chung-Yu Ting
  - et al.
- 2019
- JES
Interfacial reactions between Al and RuO₂, MoO_x and WN_x diffusion barriers on Si
- - S.-E. Hörnström
  - A. Charai
  - et al.
- 2004
- Surface and Interface Analysis
Tantalum as a diffusion barrier between copper and silicon: Failure mechanism and effect of nitrogen additions
- - Karen Holloway
  - Peter M. Fryer
  - et al.
- 1992
- Journal of Applied Physics
Tantalum as a diffusion barrier between copper and silicon
- - Karen Holloway
  - Peter M. Fryer
- 1990
- Applied Physics Letters
Chemical sputtering of Al₂O₃ by fluorine-containing plasmas excited by electron cyclotron resonance
- - Y.H. Lee
  - Z.H. Zhou
  - et al.
- 1990
- Journal of Applied Physics
Room-temperature oxidation of silicon catalyzed by Cu₃Si
- - J.M.E. Harper
  - A. Charai
  - et al.
- 1990
- Applied Physics Letters
The angular dependence of preferential sputtering and composition in aluminum-copper thin films
- - P. Rudeck
  - J.M.E. Harper
  - et al.
- 1989
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
A comparison between aluminum and copper interactions with high-temperature oxide and nitride diffusion barriers
- - A. Charai
  - S.E. Harnstram
  - et al.
- 1989
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Tungsten-rhenium alloys as diffusion barriers between aluminum and silicon
- - S.-E. Hörnström
  - T. Lin
  - et al.
- 1988
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films