High temperature process limitation on TiSi2
- C.-Y. Ting
- F.M. d'Heurle
- et al.
- 2019
- JES
Paper
Publications
15 results for Peter M. Fryer
Ambient Gas Effects on the Reaction of Titanium with Silicon
- Subramanian S. lyer
- Chung-Yu Ting
- et al.
- 2019
- JES
PaperInterfacial reactions between Al and RuO2, MoOx and WNx diffusion barriers on Si
- S.-E. Hörnström
- A. Charai
- et al.
- 2004
- Surface and Interface Analysis
PaperTantalum as a diffusion barrier between copper and silicon: Failure mechanism and effect of nitrogen additions
- Karen Holloway
- Peter M. Fryer
- et al.
- 1992
- Journal of Applied Physics
PaperChemical sputtering of Al2O3 by fluorine-containing plasmas excited by electron cyclotron resonance
- Y.H. Lee
- Z.H. Zhou
- et al.
- 1990
- Journal of Applied Physics
PaperRoom-temperature oxidation of silicon catalyzed by Cu3Si
- J.M.E. Harper
- A. Charai
- et al.
- 1990
- Applied Physics Letters
PaperTantalum as a diffusion barrier between copper and silicon
- Karen Holloway
- Peter M. Fryer
- 1990
- Applied Physics Letters
PaperThe angular dependence of preferential sputtering and composition in aluminum-copper thin films
- P. Rudeck
- J.M.E. Harper
- et al.
- 1989
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
PaperA comparison between aluminum and copper interactions with high-temperature oxide and nitride diffusion barriers
- A. Charai
- S.E. Harnstram
- et al.
- 1989
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
PaperAngular dependence of preferential sputtering and composition in aluminum-copper thin films
- P. Rudeck
- J.M.E. Harper
- et al.
- 1988
- Applied Physics Letters
Paper