PaperRelationship between substrate bias and microstructure in magnetron-sputtered AlCu filmsT. Lin, K.Y. Ahn, et al.Thin Solid Films
PaperTantalum as a diffusion barrier between copper and silicon: Failure mechanism and effect of nitrogen additionsKaren Holloway, Peter M. Fryer, et al.Journal of Applied Physics
PaperRadiation effects in thin films of high Tc superconductorsG.J. Clark, A.D. Marwick, et al.Nuclear Inst. and Methods in Physics Research, B
PaperProcessing of La1.8Sr0.2CuO4 and YBa 2Cu3O7 superconducting thin films by dual-ion-beam sputteringP.B. Madakson, J.J. Cuomo, et al.Journal of Applied Physics
