B.A. Hutchins, T.N. Rhodin, et al.
Surface Science
Paper
Summary Abstract: High performance packaging in microelectronics
Abstract
No abstract available.
Related
K.N. Tu
Materials Science and Engineering: A
D.D. Awschalom, J.-M. Halbout
Journal of Magnetism and Magnetic Materials
Hiroshi Ito, Reinhold Schwalm
JES