G.M. McClelland, C.T. Rettner, et al.
Tribology Letters
Thin polyimide films with dispersed nano-foam morphology have been investigated for the purpose of obtaining low dielectric polymer insulators for microelectronic applications. A Significant decrease in the average dielectric constant has been achieved by the formation of nano-foam morphology. We will present the polymer structure-dielectric property relationships for the matrix homopolymers and the changes brought about by final nano-foam formation.