Opportunities and challenges for 3D systems and their design

Philip Emma; Eren Kursun

doi:10.1109/MDT.2009.119

IEEE Design and Test of Computers

Paper

06 Nov 2009

Opportunities and challenges for 3D systems and their design

View publication

Abstract

Editor's note article presents the system design opportunities offered by 3D integration, and it discusses the design and test challenges for 3D ICs, with various new design-for-manufacture and DFT issues. © 2009 IEEE.

Conference paper

Analysis of spatial and temporal behavior of three-dimensional multi-core architectures towards run-time thermal management

Eren Kursun, J. Wakil, et al.

ITherm 2010

Paper

Is 3D chip technology the next growth engine for performance improvement?

Philip G. Emma, Eren Kursun

IBM J. Res. Dev

Conference paper

Trends and techniques for energy efficient architectures

Víctor Jiménez, Roberto Gioiosa, et al.

VLSI-SoC 2010

Paper

Fast poisson solvers for thermal analysis

Haifeng Qian, Sachin S. Sapatnekar, et al.

ACM TODAES

View all publications

Abstract

Related

Analysis of spatial and temporal behavior of three-dimensional multi-core architectures towards run-time thermal management

Is 3D chip technology the next growth engine for performance improvement?

Trends and techniques for energy efficient architectures

Fast poisson solvers for thermal analysis