Opportunities and challenges for 3D systems and their design

Philip Emma; Eren Kursun

doi:10.1109/MDT.2009.119

IEEE Design and Test of Computers

Paper

06 Nov 2009

Opportunities and challenges for 3D systems and their design

View publication

Abstract

Editor's note article presents the system design opportunities offered by 3D integration, and it discusses the design and test challenges for 3D ICs, with various new design-for-manufacture and DFT issues. © 2009 IEEE.

Paper

Through silicon via aware design planning for thermally efficient 3-D integrated circuits

Yibo Chen, Eren Kursun, et al.

IEEE TCADIS

Conference paper

Power-efficient, reliable microprocessor architectures: Modeling and design methods

Pradip Bose, Alper Buyuktosunoglu, et al.

GLSVLSI 2010

Paper

Characterizing power and temperature behavior of POWER6-based system

Víctor Jiménez, Francisco J. Cazorla, et al.

IEEE JESTCS

Conference paper

Thermomechanical stress-aware management for 3D IC designs

Qiaosha Zou, Tao Zhang, et al.

DATE 2013

View all publications

Abstract

Related

Through silicon via aware design planning for thermally efficient 3-D integrated circuits

Power-efficient, reliable microprocessor architectures: Modeling and design methods

Characterizing power and temperature behavior of POWER6-based system

Thermomechanical stress-aware management for 3D IC designs