Conference paper
Post porosity plasma protection integration at 48 nm pitch
H. Huang, Krystelle Lionti, et al.
IITC/AMC 2016
In our study, we evaluate effective silicon and germanium oxide reduction by two surface treatments to achieve low contact resistivity at the semiconductor/metal interface. These chemistries, one alkaline and the other an acidic fluorine-based treatment, were utilized on epitaxial n-type Si
H. Huang, Krystelle Lionti, et al.
IITC/AMC 2016
Lina S. Abdallah, Stefan Zollner, et al.
JVSTB
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VLSI Technology 2019
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IEDM 2016