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Technical Digest-International Electron Devices Meeting
A simple u.v. curing process is described that renders micron sized images in AZ resists resistant to flow when heated to temperatures as high as 210° C. The u.v. treatment prevents the image flow problems usually encountered in reactive ion etching processes. © 1981, The Electrochemical Society, Inc. All rights reserved.
Min Yang, Jeremy Schaub, et al.
Technical Digest-International Electron Devices Meeting
A. Krol, C.J. Sher, et al.
Surface Science
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Inorganic Chemistry
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Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures