Mattias Vervaele, Bert De Roo, et al.
Review of Scientific Instruments
The monolithic integration of power-efficient optoelectronic devices with CMOS circuits is critical for future on-chip optical communication. In such platforms, ultra-high-speed photodetectors operating at datacom wavelengths are essential to convert optical signals in the electrical domain. Here, we demonstrate ultra-compact high-speed III-V/Si photodetectors integrated on silicon photonics and exclusively fabricated with processes and materials compatible with CMOS foundries. The sub-femtofarad capacitance, high responsivity photodetectors demonstrate a bandwidth around 65 GHz and data reception at 100 GBd OOK. Their thickness and efficiency enable an integration in the back-end-of-line without using an amplifier, further reducing the power consumption of the link.
Mattias Vervaele, Bert De Roo, et al.
Review of Scientific Instruments
Veeresh Deshpande, Herwig Hahn, et al.
VLSI Technology 2017
Mattia Halter, Laura Bégon-Lours, et al.
Communications Materials
Olivier Maher, Folkert Horst, et al.
ESSERC 2024