Conference paperControlling gaseous and particulate contamination in data centersC. Muller, W.L. Yao, et al.ISHVAC 2011
Conference paperFormulation of percolating thermal underfill by sequential convective gap fillingThomas Brunschwiler, Javier V. Goicochea, et al.ISHVAC 2011
Conference paperAn 8x10-Gb/s source-synchronous I/O system based on high-density silicon carrier interconnectsTimothy O. Dickson, Yong Liu, et al.VLSI Circuits 2011
Conference paperCharacterization of flip chip microjoins up to 40 GHz using silicon carrierChirag S. Patel, Paul S. Andry, et al.IITC 2005
