John G. Long, Peter C. Searson, et al.
JES
A 0.5 μ m fully depleted CMOS on thin SOI (silicon-on-insulator) VLSI technology has been developed for SRAM and logic applications. Using a normally off, accumulation mode SOI device design with the source/drain/substrate having the same doping polarity, the device transconductance, mobility, and gate delay are improved by 40% over conventional enhancement mode devices. By cooling the devices to liquid nitrogen temperature, both n-and p-channel devices show improvement in mobility and transconductance, reduction of subthreshold slopes, and an increase of breakdown voltages from the floating substrates.
John G. Long, Peter C. Searson, et al.
JES
Kafai Lai, Alan E. Rosenbluth, et al.
SPIE Advanced Lithography 2007
J.H. Comfort, E.F. Crabbe, et al.
IEDM 1991
E. Burstein
Ferroelectrics