Young H. Kwark, Miroslav Kotzev, et al.
IMS 2011
When a high-speed signal transits through a via that penetrates a plane pair, parallel-plane resonances can cause additional insertion loss for the signal. To eliminate this via-plane coupling, ground vias are added adjacent to the signal via. This paper discusses the impact of the ground vias as a function of the number of the ground vias, their locations, and the size of the plane pair. A block-by-block physics-based equivalent circuit modeling approach is used in the study. The underlying physics of the phenomenon and the design implications are also discussed in the paper. © 2008 IEEE.
Young H. Kwark, Miroslav Kotzev, et al.
IMS 2011
Thomas-Michael Winkel, Hubert Harrer, et al.
EPEPS 2012
Dong G. Kam, Mark B. Ritter, et al.
IEEE Transactions on Advanced Packaging
Xiaoxiong Gu, Albert E. Ruehli, et al.
EPEPS 2008