Simulating electromagnetic radiation of printed circuit boards
H. Heeb, A.E. Ruehli, et al.
ICCAD 1990
A model is developed for estimating effects due to electron scattering from grain boundaries, occurring simultaneously with background scattering. Since grain-boundary effects are negligible in bulk materials, the model is particularly relevant to polycrystalline metal films in which a very fine-grained structure is often found. It is shown by solution of the appropriate Boltzmann equation, that the total resistivity can be strongly dominated by grain-boundary scattering. If grain size increases with film thickness, a marked dependence of resistivity on thickness exists, even when scattering from external surfaces is negligible or is completely specular. © 1969 The American Institute of Physics.
H. Heeb, A.E. Ruehli, et al.
ICCAD 1990
R. Car, A. Selloni, et al.
Physica B+C
J.F. Janak
Physical Review B
M. Av-Ron, M. Shatzkes, et al.
Japanese Journal of Applied Physics