Stress relaxation in Cu thin films
C. Witt, R. Rosenberg, et al.
International Workshop on Stress-Induced Phenomena in Metallization 2008
It is shown that relatively thick (10 000-Å) films of aluminum thinned by sputter-etching exhibit an increase in both the room-temperature and helium-temperature resistivities, and that this increase is too large to be explained in terms of the Fuchs (thickness) size effect or by changes in the specular scattering probability p. A part of the increase in the helium-temperature resistivity anneals out after 2 h at 250°C but a large increment remains. It is suggested that topographic and structural changes in the films may be responsible. © 1969 The American Institute of Physics.
C. Witt, R. Rosenberg, et al.
International Workshop on Stress-Induced Phenomena in Metallization 2008
R. Rosenberg, A.F. Mayadas, et al.
Surface Science
R. Rosenberg
MRS Spring Meeting 1994
S.I. Tan, A.F. Mayadas
Journal of Applied Physics