Conference paper
Investigation of FinFET devices for 32nm technologies and beyond
H. Shang, L. Chang, et al.
VLSI Technology 2006
In this letter, we report germanium (Ge) p-channel MOSFETs with a thin gate stack of Ge oxynitride and low-temperature oxide (LTO) on bulk Ge substrate without a silicon (Si) cap layer. The fabricated devices show 2 × higher transconductance and ∼ 40% hole mobility enhancement over the Si control with a thermal SiO2 gate dielectric, as well as the excellent subthreshold characteristics. For the first time, we demonstrate Ge MOSFETs with less than 100-mV/dec subthreshold slope.
H. Shang, L. Chang, et al.
VLSI Technology 2006
Marwan Khater, J. Cai, et al.
VLSI Technology 2010
K.L. Lee, J.O. Chu, et al.
IEDM 2002
N.A. Bojarczuk, M. Copel, et al.
Applied Physics Letters