Conference paperUV cure impact on robust low-k with sub-nm pores and high carbon content for high performance Cu/low-k BEOL modulesN. Inoue, F. Ito, et al.IITC 2013
Conference paperElectromigration extendibility of Cu(Mn) alloy-seed interconnects, and understanding the fundamentalsTakeshi Nogami, C. Penny, et al.IEDM 2012
Conference paperFull Bottom Dielectric Isolation to Enable Stacked Nanosheet Transistor for Low Power and High Performance ApplicationsJ. Zhang, S. Pancharatnam, et al.IEDM 2019
Conference paper65nm Cu integration and interconnect reliability in low stress K=2.75 SiCOHV. McGahay, G. Bonilla, et al.IITC 2006