PaperSuperconductivity of lanthanum intermetallic compounds with the Cu3Au structureR.J. Gambino, N.R. Stemple, et al.Journal of Physics and Chemistry of Solids
Conference paperCoupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systemsBiancun Xie, Madhavan Swaminathan, et al.EMC 2011
TalkEnhanced Room Temperature Photoluminescence Quantum Yield in Morphology-Controlled J-AggregatesSurendra B. Anantharaman, Joachim Kohlbrecher, et al.MRS Fall Meeting 2020
PaperApplication of block-copolymer supramolecular assembly for the fabrication of complex TiO2 nanostructuresSung Ho Kim, Oun-Ho Park, et al.Small