A. Deutsch, H. Smith, et al.
IEEE Topical Meeting EPEPS 1997
A package structure involving two signal lines situated between a pair of mesh reference planes is solved using six different techniques ranging from static 2D to static 3D to full-wave 3D. Analysis methodology and code formulation is shown to yield results that closely agree among the approaches. In this paper, we demonstrate a suite of tools and a package analysis methodology that provides the user with the consistency in results needed to assure correct subsequent simulation.