F.K. LeGoues, P.S. Ho
VMIC 1985
In this paper an attempt is made to assess some of the basic problems in interconnects for VLSI applications. Based on the trend of device scaling, the increasing demands on the functional requirements of the interconnects are projected. This brings into focus two key areas of concern: wiring placement and metallization requirements.
F.K. LeGoues, P.S. Ho
VMIC 1985
M.A. Moske, P.S. Ho, et al.
Journal of Applied Physics
C.-K. Hu, M.B. Small, et al.
Applied Physics Letters
C.-K. Hu, D. Gupta, et al.
VMIC 1984