PaperElectromigration in AlCu lines: Comparison of Dual Damascene and metal reactive ion etchingR. Filippi, M. Gribelyuk, et al.Thin Solid Films
Conference paperExplanation of the high resolution backscattered electron image in the scanning electron microscope by the twin-population theory - a historical reviewO.C. WellsMSA Annual Meeting 1993
Conference paperReduced Cu interface diffusion by CoWP surface coatingC.-K. Hu, L. Gignac, et al.Microelectronic Engineering
Conference paperExtendibility of Cu damascene to 0.1 μm wide interconnectionsC.-K. Hu, K.Y. Lee, et al.MRS Spring Meeting 1998