PaperCharacterization of thin dielectric films as copper diffusion barriers using triangular voltage sweepS. Cohen, J.C. Liu, et al.MRS Spring Meeting 1999
PaperMechanisms for very long electromigration lifetime in dual-damascene Cu interconnectionsC.-K. Hu, L. Gignac, et al.Applied Physics Letters
Conference paperExtendibility of Cu damascene to 0.1 μm wide interconnectionsC.-K. Hu, K.Y. Lee, et al.MRS Spring Meeting 1998