Conference paperNEW RELIABLE STRUCTURE FOR HIGH TEMPERATURE MEASUREMENT OF SILICON WAFERS USING A SPECIALLY ATTACHED THERMOCOUPLE.S. Cohen, T.O. Sedgwick, et al.MRS Proceedings 1983
PaperSoft x-ray investigation of the effect of growth conditions on InAs/GaAs heterostructuresA. Krol, C.J. Sher, et al.Surface Science