Surface processes in plasma-assisted etching
J.W. Coburn
Symposium on Process Physics and Modeling in Semiconductor Technology 1990
The surface chemistry of silicon bombarded with a CF+3 ion beam has been studied using X-ray photoemission and Auger electron spectroscopy. The chemical species and their depth distribution in a surface exposed to CF+3 ions of different energies (0.5 kV and 2 kV) are analyzed and are related to the etching behavior of silicon. The phenomenon of electron-induced desorption of surface fluorine is examined. XPS binding energies and the relative photoionization cross sections are also determined for a number of Si, C and F containing compounds, and these are used for chemical identification of the surface species. © 1979.
J.W. Coburn
Symposium on Process Physics and Modeling in Semiconductor Technology 1990
J.W. Coburn
Superlattices and Microstructures
T.J. Chuang, K.B. Eisenthal
The Journal of Chemical Physics
W. Sesselmann, T.J. Chuang
Surface Science