S.M. Sadjadi, S. Chen, et al.
TAPIA 2009
The paper reviews our recent progress and current challenges in implementing advanced gate stacks composed of high-κ dielectric materials and metal gates in mainstream Si CMOS technology. In particular, we address stacks of doped polySi gate electrodes on ultrathin layers of high-κ dielectrics, dual-workfunction metal-gate technology, and fully silicided gates. Materials and device characterization, processing, and integration issues are discussed. © Copyright 2006 by International Business Machines Corporation.
S.M. Sadjadi, S. Chen, et al.
TAPIA 2009
Matthias Kaiserswerth
IEEE/ACM Transactions on Networking
S. Sattanathan, N.C. Narendra, et al.
CONTEXT 2005
Chi-Leung Wong, Zehra Sura, et al.
I-SPAN 2002