Joy Y. Cheng, Daniel P. Sanders, et al.
SPIE Advanced Lithography 2008
A pressure-sensing system consisting of a miniature silicon capacitive-type sensor, made with the silicon fusion bonding technique, and a detection integrated circuit is presented. The entire system converts pressure changes, in the pressure range useful for biomedical applications, to frequency changes. The system is equipped with a reference capacitor to cancel out the temperature dependence and the ageing effects. © 1997 Elsevier Science S.A.
Joy Y. Cheng, Daniel P. Sanders, et al.
SPIE Advanced Lithography 2008
J. Paraszczak, J.M. Shaw, et al.
Micro and Nano Engineering
J.K. Gimzewski, T.A. Jung, et al.
Surface Science
S. Cohen, J.C. Liu, et al.
MRS Spring Meeting 1999