Mattias Borg, Heinz Schmid, et al.
Nano Letters
Paper
A comparison of grain size measurements in Al-Cu thin films: Imaging verses diffraction techniques
Abstract
No abstract available.
Related
Conference paper
Texture evolution in Al(Cu) interconnect materials
C.E. Murray, K.P. Rodbell
MRS Proceedings 2001
K.P. Rodbell, R.H. Koch
Physical Review B
Hsin-Yu Tsai, Hiroyuki Miyazoe, et al.
SPIE Advanced Lithography 2013