PaperInvited: Magnetic bubble technology-present and futureH. ChangJapanese Journal of Applied Physics
PaperELECTROCHEMICAL TECHNOLOGY IN ELECTRONIC INDUSTRY TODAY AND ITS FUTURE: A REVIEW.L. RomankiwOberflache Zurich
Conference paperElecromigration damage in fine Al alloy lines due to interfacial diffusionC.-K. Hu, M.B. Small, et al.MRS Proceedings 1993
PaperStripping Voltammetry of Nickel-Iron Films Electrodeposited on Platinum Using a Rotating Ring-Disk ElectrodeJ. Tabib, L. RomankiwJES