Development of TiO2 containing hardmasks through plasma-enhanced atomic layer depositionAnuja De SilvaIndira Seshadriet al.2017J. Micro/Nanolithogr. MEMS MOEMS
Overlay statistics for multiple exposure patterningAllen H. GaborNelson M. Felix2017SPIE Advanced Lithography 2017
Reaching for the true overlay in advanced nodesChiew-Seng KoayBassem Hamiehet al.2017SPIE Advanced Lithography 2017
DSA patterning options for logics and memory applicationsChi Chun LiuElliott Frankeet al.2017SPIE Advanced Lithography 2017
Development of TiO2 containing hardmasks through PEALD depositionAnuja De SilvaIndira Seshadriet al.2017SPIE Advanced Lithography 2017
Electrical study of DSA shrink process and CD rectification effect at sub-60nm using EUV test vehicleCheng ChiChi Chun Liuet al.2017SPIE Advanced Lithography 2017
Unexpected impact of RIE gases on lithographic filmsMartin GloddeRobert L. Bruceet al.2017SPIE Advanced Lithography 2017
Driving down defect density in composite EUV patterning film stacksLuciana MeliKaren Petrilloet al.2017SPIE Advanced Lithography 2017
Fundamentals of EUV resist-inorganic hardmask interactionsDario GoldfarbMartin Gloddeet al.2017SPIE Advanced Lithography 2017
Ultrathin EUV patterning stack using polymer brush as an adhesion promotion layerIndira SeshadriAnuja De Silvaet al.2017SPIE Advanced Lithography 2017
IBM and Albany partners unlock new yield benchmarks for EUV patterningTechnical noteLuciana Meli and Nelson Felix24 Oct 2024Semiconductors
EUV patterning yield breakthrough sets new benchmark for logic scalingTechnical noteNelson Felix and Luciana Meli06 Nov 20204 minute readAI HardwareHardware TechnologyLogic ScalingSemiconductors
IBM Research at SPIE 2020: New architectures and fabrications for AI hardwareResearchNelson Felix21 Feb 20204 minute readAI HardwareSemiconductors