Correlation between special grain boundaries and electromigration behavior of aluminum thin films
- K.T. Lee
- J.A. Szpunar
- et al.
- 1995
- Canadian Metallurgical Quarterly
Paper
Publications
3 results at Canadian Metallurgical Quarterly
Correlation between special grain boundaries and electromigration behavior of aluminum thin films
- K.T. Lee
- J.A. Szpunar
- et al.
- 1995
- Canadian Metallurgical Quarterly
PaperDiffusion phenomena in microelectronic metallizations and interconnections
- D. Gupta
- 1995
- Canadian Metallurgical Quarterly
Paper