Correlation between special grain boundaries and electromigration behavior of aluminum thin filmsK.T. LeeJ.A. Szpunaret al.1995Canadian Metallurgical Quarterly
Correlation between special grain boundaries and electromigration behavior of aluminum thin filmsK.T. LeeJ.A. Szpunaret al.1995Canadian Metallurgical Quarterly
Diffusion phenomena in microelectronic metallizations and interconnectionsD. Gupta1995Canadian Metallurgical Quarterly