Publications

5 results at IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Development of high conductivity lead (Pb)-free conducting adhesives
- - Sung K. Kang
  - Rajinder S. Rai
  - et al.
- 1998
- IEEE Transactions on Components Packaging and Manufacturing Technology Part A
Effect of the specimen size in predicting the mechanical properties of PbSn solder alloys
- - N.R. Bonda
  - I.C. Noyan
- 1996
- IEEE Transactions on Components Packaging and Manufacturing Technology Part A
Intrinsic Thermocouple Monitor for Laser Wirebonding
- - Brian W. Hussey
  - Gnanalingam Arjavalingam
  - et al.
- 1995
- IEEE Transactions on Components Packaging and Manufacturing Technology Part A
A Practical Excimer Laser-Based Cleaning Tool For Removal Of Surface Contaminants
- - Andrew C. Tarn
  - Costas P. Grigoropoulos
- 1994
- IEEE Transactions on Components Packaging and Manufacturing Technology Part A
A Fully Integrated Planar Toroidal Inductor With A Micromachined Nickel-Iron Magnetic Bar
- - Yong J. Kim
  - Mark G. Allen
- 1994
- IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Development of high conductivity lead (Pb)-free conducting adhesives