Effects of vacuum ultraviolet surface treatment on the bonding interconnections for flip chip and 3-D integration
- Katsuyuki Sakuma
- Jun Mizuno
- et al.
- 2010
- IEEE Transactions on Electronics Packaging Manufacturing
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Electrical test strategies for a wafer-level packaging technology
- David C. Keezer
- Chirag S. Patel
- et al.
- 2003
- IEEE Transactions on Electronics Packaging Manufacturing
Interfacial reaction studies on lead (Pb)-free solder alloys
- Sung K. Kang
- D.Y. Shih
- et al.
- 2002
- IEEE Transactions on Electronics Packaging Manufacturing