Publications

8 results at IEEE Transactions on Components and Packaging Technologies

Shot noise thermometry for thermal characterization of templated carbon nanotubes
- - Robert A. Sayer
  - Sunkook Kim
  - et al.
- 2010
- IEEE Transactions on Components and Packaging Technologies
Rapid three-dimensional thermal characterization of large-scale computing facilities
- - Hendrick F. Hamann
  - James A. Lacey
  - et al.
- 2008
- IEEE Transactions on Components and Packaging Technologies
High heat flux two-phase cooling in silicon multimicrochannels
- - Bruno Agostini
  - John Richard Thome
  - et al.
- 2008
- IEEE Transactions on Components and Packaging Technologies
Investigation of the impact of power granularity on chip thermal modeling using white noise analysis
- - Keivan Etessam-Yazdani
  - Mehdi Asheghi
  - et al.
- 2008
- IEEE Transactions on Components and Packaging Technologies
Hierarchically nested channels for fast squeezing interfaces with reduced thermal resistance
- - Thomas Brunschwiler
  - Urs Kloter
  - et al.
- 2007
- IEEE Transactions on Components and Packaging Technologies
A practical implementation of silicon microchannel coolers for high power chips
- - Evan G. Colgan
  - Bruce Furman
  - et al.
- 2007
- IEEE Transactions on Components and Packaging Technologies
Development of conductive adhesive materials for via fill applications
- - Sung K. Kang
  - Stephen L. Buchwalter
  - et al.
- 2001
- IEEE Transactions on Components and Packaging Technologies
Effect of nonconducting filler additions on ACA properties and the reliability of ACA flip-chip on organic substrates
- - Myung-Jin Yim
  - Kyung-Wook Paik
- 2001
- IEEE Transactions on Components and Packaging Technologies