Publications

2 results at J. Jpn. Inst. Electron. Packag.

EMC design technology, now and future
- - Akihisa Sakurai
- 2018
- J. Jpn. Inst. Electron. Packag.
Development and commercialization of solder bump fabrication technology with molten solder injection method
- - Toyohiro Aoki
  - Kazushige Toriyama
  - et al.
- 2015
- J. Jpn. Inst. Electron. Packag.