CVD Co and its application to Cu damascene interconnectionsTakeshi NogamiJ. Maniscalcoet al.2010IITC 2010Conference paper
Molecular design of ultra-low-k hybrid glassesMark OliverGeraud Duboiset al.2010IITC 2010Conference paper
3D system design: A case for building customized modular systems in 3DPhilip EmmaEren Kursun2010IITC 2010Conference paper
A comparative study of ULK conduction mechanisms and TDDB characteristics for Cu interconnects with and without CoWP metal cap at 32nm technologyF. ChenE. Huanget al.2010IITC 2010Conference paper