Early detection of electrical defects in deep trench capacitors using voltage contrast inspection
- Brian Donovan
- Oliver D. Patterson
- et al.
- 2013
- ASMC 2013
Publications
7 results at ASMC 2013
Single wafer cleaning lessons in advanced node gate module development
- David F. Hilscher
- Daniel Jaeger
- et al.
- 2013
- ASMC 2013
TSV density impact on 3D power delivery with high aspect ratio TSVs
- Huanyu He
- James J.-Q. Lu
- et al.
- 2013
- ASMC 2013
Use of performance path test to optimize yield
- Jeanne Paulette Bickford
- Jinjun Xiong
- 2013
- ASMC 2013
E-beam inspection of EUV programmed defect wafers for printability analysis
- Ravi Bonam
- Scott Halle
- et al.
- 2013
- ASMC 2013
Hybrid clean approach for post-copper CMP defect reduction
- Wei-Tsu Tseng
- Vamsi Devarapalli
- et al.
- 2013
- ASMC 2013
Early detection of systematic patterning problems for a 22nm SOI technology using E-beam hot spot inspection
- Oliver D. Patterson
- Deborah A. Ryan
- et al.
- 2013
- ASMC 2013