Publications

3 results at 3DIC 2013

Thermal design guideline and new cooling solution for a three-dimensional (3D) chip stack
- - Keiji Matsumoto
  - Soichiro Ibaraki
  - et al.
- 2013
- 3DIC 2013
Thermo-mechanical evaluation of 3D packages
- - Sayuri Kohara
  - Akihiro Horibe
  - et al.
- 2013
- 3DIC 2013
Integration of intra chip stack fluidic cooling using thin-layer solder bonding
- - Yassir Madhour
  - Michael Zervas
  - et al.
- 2013
- 3DIC 2013