Publications

4 results at iTHERM 2023

CFD Simulation Analysis of Inter/Intra Chip Liquid Cooling for 3D Stacked ICs
- - Risa Miyazawa
  - Hiroyuki Mori
  - et al.
- 2023
- iTHERM 2023
Conference paper
Experimental Investigation of Ultra-Thin Microchannel Oscillating Heat Pipes with Submillimeter-Scale Thickness
- - Qian Qian
  - Xin Zhang
  - et al.
- 2023
- iTHERM 2023
Conference paper
Innovative Chiplet Integration Technologies for HPC and AI Hardware Systems
- - Griselda Bonilla
- 2023
- iTHERM 2023
Keynote
SUSTAINABLE COMPUTING – THERMAL CHALLENGES AND OPPORTUNITIES
- - Pritish Parida
- 2023
- iTHERM 2023
Invited talk