Publications

10 results at IRPS 2016

The projection of the incidence of dielectric cracking during chip joining with lead free solder bumps
- - Thomas M. Shaw
  - Xiao Hu Liu
  - et al.
- 2016
- IRPS 2016
Conference paper
Triangular Voltage Sweep (TVS) characterisation for Through-Silicon-Via (TSV) reliability
- - C. Kothandaraman
  - Stephan A. Cohen
- 2016
- IRPS 2016
Conference paper
The complete time/temperature dependence of I-V drift in PCM devices
- - Manuel Le Gallo
  - Abu Sebastian
  - et al.
- 2016
- IRPS 2016
Conference paper
Process optimizations for NBTI/PBTI for future replacement metal gate technologies
- - Barry P. Linder
  - A. Dasgupta
  - et al.
- 2016
- IRPS 2016
Conference paper
Spontaneous photon emission from 32 nm and 14 nm SOI FETs
- - Franco Stellari
  - Alessandro Ruggeri
  - et al.
- 2016
- IRPS 2016
Conference paper
Layout dependence of gate dielectric TDDB in HKMG FinFET technology
- - Wen Liu
  - Ernest Y. Wu
  - et al.
- 2016
- IRPS 2016
Conference paper
Fundamental statistical properties of reconstruction methodology for TDDB with variability in BEOL/MOL/FEOL applications
- - Ernest Y. Wu
  - James Stathis
  - et al.
- 2016
- IRPS 2016
Conference paper
Effect of H₂O on TDDB for a range of ULK ILD materials with varying damage resistance for robust and weak liners
- - Eric G. Liniger
  - Robert B. Laibowitz
  - et al.
- 2016
- IRPS 2016
Conference paper
Time-dependent series resistance and implications for voltage acceleration models in BEOL TDDB
- - Andrew Kim
  - Baozhen Li
  - et al.
- 2016
- IRPS 2016
Conference paper
Towards an appropriate acceleration model for beol tddb
- - Ramachandran Muralidhar
  - Eric G. Liniger
  - et al.
- 2016
- IRPS 2016
Conference paper