Skip to main content

Focus areas

Artificial Intelligence

Quantum Computing

About

Artificial Intelligence

Quantum Computing

Focus areas
Blog
Publications
Careers
About

Publications

Home
Publications

Filter by

1 result at 3DIC 2016

Thermal analysis of multi-layer functional 3D logic stacks
- - Michael Scheuermann
  - Shurong Tian
  - et al.
- 2016
- 3DIC 2016

Date

Start

End

Featured collections

Popular topics

Focus areas
Quick links
Work with us
- Careers
- Contact Research
Directories
Follow us

Contact IBM
Privacy
Terms of use
Accessibility