Publications

8 results at SPIE Advances in Intelligent Robotics Systems 1990

The application of electrodeposition processes to advanced package fabrication
- - S. Krongelb
  - J. Dukovic
  - et al.
- 1990
- SPIE Advances in Intelligent Robotics Systems 1990
Electrical characterization of the interconnects inside a computer
- - Barry J. Rubin
- 1990
- SPIE Advances in Intelligent Robotics Systems 1990
CAD in new areas of the package and interconnect design space
- - Dennis J. McBride
- 1990
- SPIE Advances in Intelligent Robotics Systems 1990
3-D capacitance modeling of advanced multilayer interconnection technologies
- - Daniel C. Edelstein
- 1990
- SPIE Advances in Intelligent Robotics Systems 1990
Electrical characteristics of lossy interconnections for high-performance computer applications
- - A. Deutsch
  - G.V. Kopcsay
  - et al.
- 1990
- SPIE Advances in Intelligent Robotics Systems 1990
Overview of optical interconnect technology
- - George Chiu
  - Modest M. Oprysko
- 1990
- SPIE Advances in Intelligent Robotics Systems 1990
Multilevel evidence fusion for the recognition of three-dimensional objects. An overview of computer vision research at IBM T.J. Watson
- - Ruud Bolle
  - Andrea Califano
  - et al.
- 1990
- SPIE Advances in Intelligent Robotics Systems 1990
Shot noise limited optical measurements at baseband with noisy lasers
- - P.C.D. Hobbs
- 1990
- SPIE Advances in Intelligent Robotics Systems 1990