Electromigration and current-carrying implications for aluminum-based metallurgy with tungsten stud-via interconnections
- H.S. Rathore
- R. Filippi
- et al.
- 1992
- SPIE Microelectronic Processing 1992
Publications
6 results at SPIE Microelectronic Processing 1992
Electromigration and stress reliability in multilevel interconnect metallization
- Paul S. Ho
- M.A. Moske
- et al.
- 1992
- SPIE Microelectronic Processing 1992
Effects of texture, microstructure, and alloy content on electromigration of aluminum-based metallization
- D.B. Knorr
- K.P. Rodbell
- 1992
- SPIE Microelectronic Processing 1992
Performance consideration for the scaling of sub-micron on-chip interconnections
- Yuh-Jier Mii
- 1992
- SPIE Microelectronic Processing 1992
Effect of strain on diffusion kinetics and activation energy for al grain-boundary diffusion: A computer simulation
- Thomas Kwok
- 1992
- SPIE Microelectronic Processing 1992
High pressure CVD tungsten-stud formation using RIE cluster processes
- H.Y. Ng
- D.J. Dichauzi
- 1992
- SPIE Microelectronic Processing 1992