Novel elastomeric connector for packaging interconnections, testing and burn-in applications
- D.Y. Shih
- Brian Beaman
- et al.
- 1995
- ECTC 1995
Conference paper
Publications
5 results at ECTC 1995
Adhesion test standardization for multichip module packages
- D.Y. Shih
- J. Kim
- et al.
- 1995
- ECTC 1995
Conference paperPolymer/metal composite for interconnection technology
- Ravi F. Saraf
- Judith Roldan
- et al.
- 1995
- ECTC 1995
Conference paperInterfacial reactions with lead (Pb)-free solders
- R.S. Rai
- S.K. Kang
- et al.
- 1995
- ECTC 1995
Conference paperPolyimide stress cushion for multichip glass-ceramic module packaging
- D.Y. Shih
- P. Palmateer
- et al.
- 1995
- ECTC 1995
Conference paper