Publications

2 results at INTERpack 1995

Encapsulation of flex inner lead bonds for enhanced reliability
- - L.T. Shi
  - C. Feger
  - et al.
- 1995
- INTERpack 1995
Conference paper
Tolerancing electronic packaging assemblies
- - Vijay Srinivasan
  - Michael A. O'Connor
- 1995
- INTERpack 1995
Conference paper