Publications

3 results at ESREF 2005

Photon emission microscopy of inter/intra chip device performance variations
- - S. Polonsky
  - M. Bhushan
  - et al.
- 2005
- ESREF 2005
Conference paper
Innovative packaging technique for backside optical testing of wire-bonded chips
- - A. Tosi
  - F. Stellari
  - et al.
- 2005
- ESREF 2005
Conference paper
Characterization of a 0.13 μm CMOS link chip using time resolved emission (TRE)
- - Franco Stellari
  - Peilin Song
  - et al.
- 2005
- ESREF 2005
Conference paper